Reporting to the VP, Product Engineering
The candidate will be responsible for the development of new packaging technologies for Photonic Integrated Circuit (PIC)-based high-speed optical transceivers (40Gb/s, 100Gb/s). This will include modeling, material evaluation, prototype build, validation testing, data analysis and transferring the new designs to volume production.
The role will require working closely with the PIC, Transceiver Design, Mechanical Engineering, Process Engineering and Product Reliability teams to define specifications and design and evaluate product performance.
The role will require working with vendors on design, specification and procuring materials and subcomponents, as well as working with Operations and our contract manufacturer (CM) to develop manufacturable processes for building the new products.
The candidate will work with project management to define schedules for prototype builds, sample builds, qualification and production start.
The role requires the complete documentation of product design and manufacturing processes.
A M.Sc. or Ph.D. in Engineering Physics, Mechanical Engineering, Electrical Engineering, Materials Science or related field and at least 10 years experience in the packaging of optoelectronics products, especially high-bit-rate optical transceivers.
The candidate shall have direct experience with photonic integration technologies and a solid understanding of optoelectronic devices (lasers, modulators, photodetectors), RF electronics (transmission lines, modulation response, impedance matching), and optics (e.g. coupling between devices and optical fiber).
The candidate shall have experience with the detailed modeling of the thermal, electrical, and optical properties of optoelectronics devices, both DC and RF performance.
The candidate shall have strong organizational and communication skills with the ability to organize projects involving multidisciplinary teams and to drive tasks to completion.