Reporting to the Director, Engineering Operations
Description of responsibilities
The candidate will be responsible for the design and documentation of mechanical packaging solutions for OneChip’s TOSA, ROSA and Transceiver products. The candidate will work within the Mechanical Design team, liaising with Process Engineering, Transceiver Design, and Manufacturing teams to support their requirements. The candidate will liaise with external packaging, machining, sheet metal, casting, chemical etching, and finishing shops to secure finished goods per their designs.
The candidate’s secondary responsibility will be for the design and documentation of tooling, fixturing, passive/active optical alignment systems, used to assemble, test, and characterize PIC based transceivers.
The candidate should have experience in the mechanical design and development of packaging solutions for opto-electronic products from concept to volume manufacturing. A proven track record of drafting using ProEngineer is required. Experience with delivering packaging solutions for TOSA, ROSA and transceivers and knowledge of adhesives, OE packaging materials including Kovar and ceramics would be an asset.
Experience designing automated optical alignment (fibers, mirrors, lenses, etc.) systems, laser die testing systems (wafer and bar form), di-electric coating jigs, and assembly fixtures is strongly desired.
Experience designing opto-electronic products, specifically transceivers in SFF, SFP, QSFP and CFP packages would be desirable.
The candidate will have good communications skills, have experience holding and contributing to design reviews, and have experience working with external suppliers to provide quality work within tight timelines.
3-5 years ProEngineer experience is required.
A BS in Mechanical Engineering with 5-7 years experience or relevant training with 10 years experience is required.